XDR™ Applications

The Rambus XDR™ memory interface solution satisfies the needs of many demanding applications such as computer graphics, servers, networking, and consumer electronics. With the flexibility to provide orders of magnitude more bandwidth than competing technologies, XDR interfaces can also reduce overall systems costs for consumer products sensitive to total component count. XDIMM modules provide an appropriate solution for high-capacity applications as well. No other memory technology provides the flexibility that XDR offers to system and chip designers across multiple markets.

Main Memory

XDR is an appropriate solution for main memory applications in next-generation computing systems such as personal computers, servers, and supercomputers. Many of these systems need a cost-effective solution that delivers both high-bandwidth and scalable capacity. Main memory applications have typically been addressed using discrete memory controllers. However, many new systems are being designed with either direct-attach and fully-buffered configurations. XDR is designed to work well with all of these configurations.

XIO Cell integrated into Northbridge Supports module and die-down systems Peak bandwidth: 64GB/s Capacity range: 128MB - 4GB	XIO Cell integrated into Processor Supports module and die-down systems Peak bandwidth: Up to 250GB/s Capacity range: 128MB - 4GB	XIO Cell integrated into buffer chip Allows several modules per memory controller Memory controller designed for XDR Rambus offers link between controller and buffer: RaSer and FlexIO

Consumer Electronics

XDR provides a performance edge for the latest in state-of-the-art consumer electronics products. Developing innovative new products at consumer-friendly price points is a challenge for designers as they attempt to reduce BOM costs. XDR satisfies the memory bandwidth requirements of these systems with fewer components and lower interface power. Integrated FlexPhase™ technology eliminates the need to length-match PCB and package traces, conserving valuable board area and reducing the system's time-to-market. Additionally, XDR uses differential signaling DRSL which reduces the overall I/O power and performs better in EMI tests than signaling schemes from competing memory technologies. XDR reduces the overall cost and time for bringing consumer electronics products to market.

Computer Graphics

Graphics processing systems render 2D and 3D images from increasing amounts of pre-processed data. These systems demand large amounts of bandwidth from their memory systems to deal with increasingly complex images. As the demand for eye-catching imagery and photo-realistic gaming increases, graphics systems will need a memory technology that can deliver an order of magnitude more bandwidth than today's best options. With per-pin data rates ranging from 3.2 to 8.0 GHz, XDR can satisfy the needs of today's and tomorrow's most complex graphics processing systems.

Networking

Today's advanced networking systems require a highly efficient memory technology capable of sustaining very high data rates even with demanding access patterns. Network systems typically incur latency penalties associated with a large number of bank conflicts and bus turnarounds. With features like Early Read After Write and an eight-bank memory core, XDR is up to 20% more efficient than competing memory technologies. Many leading DRAM manufacturers have committed to supply XDR DRAMs, making it a better option for high-volume network systems than specialty network memory technologies. XDR packs the efficiency of a network memory into a high-volume technology making it an ideal solution for new network system designs.