合作夥伴解決方案

Rambus與產業頂尖的技術公司合作，提供其高速介面給消費者。Rambus的PCI Express®、Fibre Channel數位邏輯和實體介面和其他網路建設介面，可通過Rambus合作夥伴獲得。

Cadence

Cadence enables global electronic-design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence® software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. Cadence reported 2006 revenues of approximately $1.5 billion, and has approximately 5,300 employees. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

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ChipX

ChipX, Inc. is a Mixed-Signal ASIC company with the broadest offering of value-added ASIC solutions, including Standard Cell, Structured ASIC, Embedded Array and Hybrid ASIC technology. ChipX has unique expertise in PCI Express, USB 2.0, DDR/DDR2 and data conversion Mixed-Signal cores; all are silicon proven and certified and they can be integrated in customers' ASICs with a record first-time to market success. ChipX products are widely used in consumer equipment, computing peripherals, communication systems, instrumentation and industrial control, medical equipment and military/aerospace systems. Headquartered in Santa Clara, CA, ChipX is a privately held corporation, with a Research and Development subsidiary in Israel. Investors include Elron Electronic Industries, Ltd. (NASDQ: ELRN), VantagePoint Venture Partners, Wasserstein Venture Capital, UMC and Needham Capital Partners.

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GDA Technologies and Rambus

GDA Technologies is a leading Electronic Design Services (EDS) and Silicon Intellectual Property (SIP) solution provider for the Embedded, Networking, and Consumer Electronics Market. GDA is part of the L&T Infotech Product Engineering Services (PES) offerings, which aims to provide end-to-end product design capability to its customers. GDA and Rambus work closely together to meet customers' accelerated time-to-market needs by utilizing Rambus' leading IP solutions and GDA's comprehensive design services. GDA is a reseller and integrator of Rambus digital core intellectual property (IP) products, which include a complete line of controller cores for PCI Express, Ethernet, SPI4.2 and RapidIO implementations. All core architectures are highly configurable and tailored to optimize link utilization and latency while minimizing power consumption and silicon footprint. The PCI Express cores support standard versions 1.1 and 2.0 and include end point, root complex, hybrid (root complex and end point), switch port, and entire switches. Bridge interfaces to standard on-chip buses such as AHB and AXI are also available.

Rambus Acquires Digital Core IP from GDA Technologies

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PGC and Rambus

Progate Group Corporation (PGC), established in 1991, is a world-class IC design turnkey service company. It is part of TSMC Design Center Alliance (DCA) program for over ten years. PGC's rich design experiences can provide customers the benefits of first-silicon-right and fast-time-to-market.

The gate array ASIC and structured ASIC that PGC offers are good solutions for NRE cost-sensitive customers. These two solutions can provide not only low-NRE solutions but also fast turn-around time. They are suitable for most mid-to-small volume customers. In addition to the gate array and structured ASIC, PGC also provides excellent IP integration for SOC projects. PGC can provide the customers experienced IP integration and netlist-to-GDS II design turnkey service.

PGC and Rambus Inc. have collaborated to develop fully integrated and independently verified PCIe solution. By collaborating with Rambus, PGC provides the client a high-end PCI-Express switch chip, which integrates high performance PCI-Express switch and PCI bridge functionality. It has been qualified for compliance test of PCI-SIG.

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PCI Express®

符合PCI-SIG合規和經過互用性測試的Rambus PCI Express解決方案已經實行和運送到無數的大量應用。 Rambus數位核心IP具備可適應的應用介面，可減少整合所需的膠合邏輯數量到最低。Rambus PHY元件以完整序列通訊元件的方式提供，優化至可帶來最高的生產回報。

Rambus最新的PCI Express產品 - Rambus Gen2 Total Solution，提供高速、5Gbps的點對點序列連結性，以及支援3 Gbps SATA的模組化配置。除了PHY層， Gen2解決方案包含數位控制器和MAC層，以及系統內診斷和測試功能。加上後端整合、驗證、套裝和板設計支援，Rambus Gen2 Total Solution可以從概念快速部署到大量生產。

Rambus PCI Express Gen 1解決方案提供 2.5 Gbps的I/O連結性。Rambus經過生產驗證的數位控制器和PHY IP，備有180nm、130nm、90nm和65nm處理幾何，在PCI-SIG整合商清單上有多個進項，仍然是主導的PCI Express解決方案，并鎖定多個鑄工廠和ASIC ODM。

有關Rambus PCI Express解決方案的更多資料，請聯絡其中一個Rambus合作夥伴：

Cadence

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eSilicon and Rambus

eSilicon, a pioneering semiconductor Value Chain Producer (VCP), provides a comprehensive suite of design, productization and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume production of integrated circuits (ICs). The company delivers chips to system original equipment manufacturers (OEMs) and fabless semiconductor companies who serve a wide variety of markets including the consumer, computer, communications and industrial segments.

eSilicon creates a unique, optimized semiconductor Value Chain for each customer and each design - from design services and tools, to IP and materials suppliers, to test and packaging providers. By integrating this Value Chain with its internal expertise and proven eSilicon Enterprise™ infrastructure, the company has produced more than 30 million leading-edge chips for a wide range of applications including consumer, computer, communications and industrial solutions.

As a semiconductor Value Chain Producer, eSilicon has a long track record of succcessful engagements with our customers to implement chips involving both complex and simple IP blocks. The value that eSilicon brings to its customers is successful integration of complex IP (e.g. SerDes) with a multitude of other IP on the same chip and quickly productizing the chips into volume production, thus enabling our customers' silicon success.

eSilicon has utilized SerDes IP from Rambus, one of its Value Chain partners to successfully design, manufacture and productize chips for many different customers. These customers represent the communications, networking and storage market segments and the engagements involved both netlist handoff and gdsii handoff engagements.

To learn more about eSilicon and what it can offer, please visit http://www.esilicon.com/about_us/about_us.php or send an e-mail to info@esilicon.com.