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Press ReleaseRambus Signs Memorandum of Understanding with IntelCompany to provide technology and design resources for evaluation effort of XDR™ memory architecture Los Altos, California, United States - 11/07/2007 Rambus Inc. (NASDAQ:RMBS), one of the world's premier technology licensing companies specializing in high-speed memory architectures, has signed a memorandum of understanding with Intel to explore possible uses for Rambus' family of XDR™ memory solutions. Rambus plans to dedicate certain technology and design resources to the effort and the evaluation will be done on Intel’s silicon process technology. The Company stressed that Intel was only evaluating the technology for possible future uses and has no specific product plans for the XDR memory technology at this time. The XDR memory architecture features key enabling technologies built on patented Rambus innovations that include low-voltage, low-power Differential Rambus Signaling Level (DRSL); FlexPhase™ circuit technology for precise on-chip alignment of data with clock; and Dynamic-Point-to-Point (DPP) for scalable point-to-point signaling on the data bus.
關於Rambus Inc.Rambus 是全球首屈一指的專長於高速晶片介面發明與設計的技術授權企業。公司始建於1990 年，其專利的創新技術、突破性技術以及著名的集成專家經驗幫助業內領先的晶片與系統企業向市場上推出卓越產品。Rambus 的技術與產品能夠解決客戶最複雜的晶片與系統級介面難題，從而幫助計算、通信與消費電子設備實現前所未有的性能。Rambus 為其世界級的專利組合以及領先的行業標準介面系列產品發放使用授權。Rambus 總部位於加利福尼亞州Los Altos，在北卡羅來納州、印度、德國、日本和臺灣等地設有地區性辦事處。瞭解更多資訊，請訪問網站 www.rambus.com.tw 。
Contacts
Linda Ashmore |
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- XDR World’s fastest memory solution with performance up to 8Ghz
- Custom Solutions Sophisticated memory and logic designs for challenging system implementations
- RDRAM The first high-performance memory for computing and consumer electronics
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- DDR Digital controllers and physical interfaces for DDR2 and DDR3
- Partner Products Digital logic and physical interfaces for PCI Express®, Fibre Channel and other networking interfaces
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