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Press ReleaseRambus Signs Patent License Agreement With Renesas Technology Corp.
LOS ALTOS, California, United States - 09/25/2005 Rambus Inc. (Nasdaq:RMBS), one of the world's premier technology licensing companies specializing in high-speed chip interfaces, today announced it has signed a patent license agreement with Renesas Technology Corp. that allows the development and manufacture of integrated circuits (ICs) employing interfaces based on Rambus patented inventions. The agreement is for a five-year term and covers high-speed controllers and other interfaces invented by Rambus. Under the agreement, Renesas will provide monetary and other compensation to Rambus. Specific terms of the agreement are confidential. "Renesas is a global leader in the semiconductor market and signing this renewal represents strong validation of our patent portfolio," said Harold Hughes, chief executive officer at Rambus. "This agreement continues our relationship with an industry leader and expands the availability of our technology in the market." Since its founding in 1990, Rambus has focused on advancing electronic system performance through innovations in logic and memory interfaces, controller architectures, and system design. The result is a broad portfolio of innovations and patents that enables semiconductor manufacturers and system designers to achieve ever-increasing levels of functionality and performance, to lower system costs, to mitigate risk with silicon-proven designs, and to reduce time to market. For more information on Rambus patent portfolio, please visit www.rambus.com/products/innovationslicensing/.
關於Rambus Inc.Rambus 是全球首屈一指的專長於高速晶片介面發明與設計的技術授權企業。公司始建於1990 年，其專利的創新技術、突破性技術以及著名的集成專家經驗幫助業內領先的晶片與系統企業向市場上推出卓越產品。Rambus 的技術與產品能夠解決客戶最複雜的晶片與系統級介面難題，從而幫助計算、通信與消費電子設備實現前所未有的性能。Rambus 為其世界級的專利組合以及領先的行業標準介面系列產品發放使用授權。Rambus 總部位於加利福尼亞州Los Altos，在北卡羅來納州、印度、德國、日本和臺灣等地設有地區性辦事處。瞭解更多資訊，請訪問網站 www.rambus.com.tw 。
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Linda Ashmore |
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