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파트너 솔루션
Rambus는 업계 선두의 기술 회사와 파트너 관계를 맺어 고객에게 고속 인터페이스를 제공합니다. PCI Express®의 Rambus 디지털 로직 및 물리적 인터페이스, 광채널 및 기타 네트워킹 인터페이스는 Rambus 파트너를 통해 구입할 수 있습니다.
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Cadence
Cadence enables global electronic-design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence® software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. Cadence reported 2006 revenues of approximately $1.5 billion, and has approximately 5,300 employees. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
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ChipX
ChipX, Inc. is a Mixed-Signal ASIC company with the broadest offering of value-added ASIC solutions, including Standard Cell, Structured ASIC, Embedded Array and Hybrid ASIC technology. ChipX has unique expertise in PCI Express, USB 2.0, DDR/DDR2 and data conversion Mixed-Signal cores; all are silicon proven and certified and they can be integrated in customers' ASICs with a record first-time to market success. ChipX products are widely used in consumer equipment, computing peripherals, communication systems, instrumentation and industrial control, medical equipment and military/aerospace systems. Headquartered in Santa Clara, CA, ChipX is a privately held corporation, with a Research and Development subsidiary in Israel. Investors include Elron Electronic Industries, Ltd. (NASDQ: ELRN), VantagePoint Venture Partners, Wasserstein Venture Capital, UMC and Needham Capital Partners.
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GDA Technologies and Rambus
GDA Technologies is a leading Electronic Design Services (EDS) and Silicon Intellectual Property (SIP) solution provider for the Embedded, Networking, and Consumer Electronics Market. GDA is part of the L&T Infotech Product Engineering Services (PES) offerings, which aims to provide end-to-end product design capability to its customers. GDA and Rambus work closely together to meet customers' accelerated time-to-market needs by utilizing Rambus' leading IP solutions and GDA's comprehensive design services. GDA is a reseller and integrator of Rambus digital core intellectual property (IP) products, which include a complete line of controller cores for PCI Express, Ethernet, SPI4.2 and RapidIO implementations. All core architectures are highly configurable and tailored to optimize link utilization and latency while minimizing power consumption and silicon footprint. The PCI Express cores support standard versions 1.1 and 2.0 and include end point, root complex, hybrid (root complex and end point), switch port, and entire switches. Bridge interfaces to standard on-chip buses such as AHB and AXI are also available.
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PGC and Rambus
Progate Group Corporation (PGC), established in 1991, is a world-class IC design turnkey service company. It is part of TSMC Design Center Alliance (DCA) program for over ten years. PGC's rich design experiences can provide customers the benefits of first-silicon-right and fast-time-to-market.
The gate array ASIC and structured ASIC that PGC offers are good solutions for NRE cost-sensitive customers. These two solutions can provide not only low-NRE solutions but also fast turn-around time. They are suitable for most mid-to-small volume customers. In addition to the gate array and structured ASIC, PGC also provides excellent IP integration for SOC projects. PGC can provide the customers experienced IP integration and netlist-to-GDS II design turnkey service.
PGC and Rambus Inc. have collaborated to develop fully integrated and independently verified PCIe solution. By collaborating with Rambus, PGC provides the client a high-end PCI-Express switch chip, which integrates high performance PCI-Express switch and PCI bridge functionality. It has been qualified for compliance test of PCI-SIG.
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PCI Express®
PCI-SIG와 호환되고 상호 작동성 테스트를 거친 Rambus PCI Express 솔루션은 다양한 대형 응용 프로그램에 구현되어 출하되었습니다. Rambus 디지털 코어 IP에는 통합에 필요한 글루 로직의 양을 최소화할 수 있는 응용 프로그램 인터페이스가 있습니다. Rambus PHY 셀은 최대 생산량에 적합하도록 최적화된 완전 직렬 통신 셀로 제공됩니다.
Rambus의 최신 PCI Express 제품인 Rambus Gen2 Total Solution은 3Gbps SATA를 지원하는 모듈형 구성 뿐만 아니라 5Gbps의 고속 Point-to-Point 직렬 연결을 제공합니다. PHY 계층과 함께 Gen2 솔루션은 시스템 내 진단 및 테스트 기능 뿐만 아니라 디지털 컨트롤러 및 MAC 계층으로 구성되어 있습니다. 백 엔드 통합, 유효성 검증, 패키지 및 보드 설계 지원과 함께 Rambus Gen2 Total Solution을 사용하면 컨셉 단계에서부터 대량 생산까지 신속하게 배치할 수 있습니다.
Rambus PCI Express Gen 1 솔루션은 2.5Gbps로 I/O 연결을 제공합니다. 180nm, 130nm, 90nm 및 65nm 프로세스 구조로 제공되며 Rambus의 생산이 입증된 디지털 컨트롤러 및 PHY IP는 PCI-SIG 통합업체 목록의 여러 항목에서 선도적인 PCI Express 솔루션 자리를 지키고 있으며, 여러 제조공장 및 ASIC ODM을 대상으로 합니다.
Rambus PCI Express 솔루션에 대한 자세한 내용은 다음과 같은 Rambus 파트너에 문의하십시오.
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Cadence
Cadence enables global electronic-design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence® software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. Cadence reported 2006 revenues of approximately $1.5 billion, and has approximately 5,300 employees. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
For more information, please visit:
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eSilicon and Rambus
eSilicon, a pioneering semiconductor Value Chain Producer (VCP), provides a comprehensive suite of design, productization and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume production of integrated circuits (ICs). The company delivers chips to system original equipment manufacturers (OEMs) and fabless semiconductor companies who serve a wide variety of markets including the consumer, computer, communications and industrial segments.
eSilicon creates a unique, optimized semiconductor Value Chain for each customer and each design - from design services and tools, to IP and materials suppliers, to test and packaging providers. By integrating this Value Chain with its internal expertise and proven eSilicon Enterprise™ infrastructure, the company has produced more than 30 million leading-edge chips for a wide range of applications including consumer, computer, communications and industrial solutions.
As a semiconductor Value Chain Producer, eSilicon has a long track record of succcessful engagements with our customers to implement chips involving both complex and simple IP blocks. The value that eSilicon brings to its customers is successful integration of complex IP (e.g. SerDes) with a multitude of other IP on the same chip and quickly productizing the chips into volume production, thus enabling our customers' silicon success.
eSilicon has utilized SerDes IP from Rambus, one of its Value Chain partners to successfully design, manufacture and productize chips for many different customers. These customers represent the communications, networking and storage market segments and the engagements involved both netlist handoff and gdsii handoff engagements.
To learn more about eSilicon and what it can offer, please visit http://www.esilicon.com/about_us/about_us.php or send an e-mail to info@esilicon.com.
For more information, please visit:
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GDA Technologies and Rambus
GDA Technologies is a leading Electronic Design Services (EDS) and Silicon Intellectual Property (SIP) solution provider for the Embedded, Networking, and Consumer Electronics Market. GDA is part of the L&T Infotech Product Engineering Services (PES) offerings, which aims to provide end-to-end product design capability to its customers. GDA and Rambus work closely together to meet customers' accelerated time-to-market needs by utilizing Rambus' leading IP solutions and GDA's comprehensive design services. GDA is a reseller and integrator of Rambus digital core intellectual property (IP) products, which include a complete line of controller cores for PCI Express, Ethernet, SPI4.2 and RapidIO implementations. All core architectures are highly configurable and tailored to optimize link utilization and latency while minimizing power consumption and silicon footprint. The PCI Express cores support standard versions 1.1 and 2.0 and include end point, root complex, hybrid (root complex and end point), switch port, and entire switches. Bridge interfaces to standard on-chip buses such as AHB and AXI are also available.
For more information, please visit:
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광채널, 이더넷, RapidIO 및 SPI-4.2
Rambus의 광채널, 이더넷, RapidIO 및 SPI-4.2 SerDes 셀은 통신 시스템의 고유한 구성과 요구사항을 충족할 수 있는 다양한 솔루션을 제공합니다. 전력 소비를 최소화하고 높은 포트 밀도를 가능하게 하면서 최적화된 폼 팩터를 구축할 수 있습니다. 이러한 셀은 모두 실리콘 기반의 셀이며 엄격한 평가와 특성화를 거쳐 표준에서 요구하는 것 이상으로 충족시킬 수 있습니다.
Rambus의 광채널, 이더넷, RapidIO 및 SPI-4.2 SerDes 셀에 대한 자세한 내용은 Rambus의 파트너에 문의하십시오.
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PCI Express 및 PCI-SIG는 PCI Express Special Interest Group의 등록 상표입니다. PCI-SIG는 PCI 스펙을 업계 공개 표준으로 소유하고 관리하는 특별이익단체입니다.
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