パートナーソリューション

ラムバスでは、業界トップのテクノロジ企業と提携して、高速インタフェイスを提供しています。PCI Express®、ファイバチャネル、および他のネットワーキングインタフェイスに対応するラムバスのデジタルロジックインタフェイスおよび物理的インタフェイスは、ラムバスの提携企業よりご利用いただけます。

Cadence

Cadence enables global electronic-design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence® software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. Cadence reported 2006 revenues of approximately $1.5 billion, and has approximately 5,300 employees. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

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ChipX

ChipX, Inc. is a Mixed-Signal ASIC company with the broadest offering of value-added ASIC solutions, including Standard Cell, Structured ASIC, Embedded Array and Hybrid ASIC technology. ChipX has unique expertise in PCI Express, USB 2.0, DDR/DDR2 and data conversion Mixed-Signal cores; all are silicon proven and certified and they can be integrated in customers' ASICs with a record first-time to market success. ChipX products are widely used in consumer equipment, computing peripherals, communication systems, instrumentation and industrial control, medical equipment and military/aerospace systems. Headquartered in Santa Clara, CA, ChipX is a privately held corporation, with a Research and Development subsidiary in Israel. Investors include Elron Electronic Industries, Ltd. (NASDQ: ELRN), VantagePoint Venture Partners, Wasserstein Venture Capital, UMC and Needham Capital Partners.

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GDA Technologies and Rambus

GDA Technologies is a leading Electronic Design Services (EDS) and Silicon Intellectual Property (SIP) solution provider for the Embedded, Networking, and Consumer Electronics Market. GDA is part of the L&T Infotech Product Engineering Services (PES) offerings, which aims to provide end-to-end product design capability to its customers. GDA and Rambus work closely together to meet customers' accelerated time-to-market needs by utilizing Rambus' leading IP solutions and GDA's comprehensive design services. GDA is a reseller and integrator of Rambus digital core intellectual property (IP) products, which include a complete line of controller cores for PCI Express, Ethernet, SPI4.2 and RapidIO implementations. All core architectures are highly configurable and tailored to optimize link utilization and latency while minimizing power consumption and silicon footprint. The PCI Express cores support standard versions 1.1 and 2.0 and include end point, root complex, hybrid (root complex and end point), switch port, and entire switches. Bridge interfaces to standard on-chip buses such as AHB and AXI are also available.

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PGC and Rambus

Progate Group Corporation (PGC), established in 1991, is a world-class IC design turnkey service company. It is part of TSMC Design Center Alliance (DCA) program for over ten years. PGC's rich design experiences can provide customers the benefits of first-silicon-right and fast-time-to-market.

The gate array ASIC and structured ASIC that PGC offers are good solutions for NRE cost-sensitive customers. These two solutions can provide not only low-NRE solutions but also fast turn-around time. They are suitable for most mid-to-small volume customers. In addition to the gate array and structured ASIC, PGC also provides excellent IP integration for SOC projects. PGC can provide the customers experienced IP integration and netlist-to-GDS II design turnkey service.

PGC and Rambus Inc. have collaborated to develop fully integrated and independently verified PCIe solution. By collaborating with Rambus, PGC provides the client a high-end PCI-Express switch chip, which integrates high performance PCI-Express switch and PCI bridge functionality. It has been qualified for compliance test of PCI-SIG.

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PCI Express®

PCI-SIG準拠および相互運用性試験に合格しているRambus PCI Expressソリューションは、数々の大容量アプリケーションに実装・搭載されています。ラムバスのデジタルコアIPは順応性のあるアプリケーションインタフェイスを保持し、統合に必要なグルーロジックの量を最小限に抑えます。ラムバスのPHYセルは、最大の生産を実現するために最適化された完全なシリアル通信セルとして提供されます。

ラムバスの最新PCI Express、Rambus Gen2 Total Solutionは、高速な5 Gbpsのポイントツーポイントシリアル接続、および3 Gbps SATAをサポートするモジュール構成を特徴としています。Gen2ソリューションは、PHY層の他に、デジタルコントローラとMAC層で構成され、システム内の診断およびテスト機能を搭載しています。Rambus Gen2 Total Solutionは、バックエンド統合、検証、パッケージ、および基板設計サポートが一体となって、構想から大量生産に至るまでのすばやい展開を実現しています。

Rambus PCI Express Gen 1ソリューションは2.5 GbpsでI/O接続を提供します。ラムバス製造の実証済みデジタルコントローラおよびPHY IP (180nm、130nm、90nm、65nmのプロセスジオメトリ) は、現在も最先端のPCIソリューションとして、PCI-SIGインテグレータリストに多数エントリされ、多数の鋳造およびASIC ODMを対象にしています。

Rambus PCI Expressソリューションに関する詳細情報はラムバス各提携会社までご連絡ください。


Cadence

Cadence enables global electronic-design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence® software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. Cadence reported 2006 revenues of approximately $1.5 billion, and has approximately 5,300 employees. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

For more information, please visit:


eSilicon and Rambus

eSilicon, a pioneering semiconductor Value Chain Producer (VCP), provides a comprehensive suite of design, productization and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume production of integrated circuits (ICs). The company delivers chips to system original equipment manufacturers (OEMs) and fabless semiconductor companies who serve a wide variety of markets including the consumer, computer, communications and industrial segments.

eSilicon creates a unique, optimized semiconductor Value Chain for each customer and each design - from design services and tools, to IP and materials suppliers, to test and packaging providers. By integrating this Value Chain with its internal expertise and proven eSilicon Enterprise™ infrastructure, the company has produced more than 30 million leading-edge chips for a wide range of applications including consumer, computer, communications and industrial solutions.

As a semiconductor Value Chain Producer, eSilicon has a long track record of succcessful engagements with our customers to implement chips involving both complex and simple IP blocks. The value that eSilicon brings to its customers is successful integration of complex IP (e.g. SerDes) with a multitude of other IP on the same chip and quickly productizing the chips into volume production, thus enabling our customers' silicon success.

eSilicon has utilized SerDes IP from Rambus, one of its Value Chain partners to successfully design, manufacture and productize chips for many different customers. These customers represent the communications, networking and storage market segments and the engagements involved both netlist handoff and gdsii handoff engagements.

To learn more about eSilicon and what it can offer, please visit http://www.esilicon.com/about_us/about_us.php or send an e-mail to info@esilicon.com.

For more information, please visit:


GDA Technologies and Rambus

GDA Technologies is a leading Electronic Design Services (EDS) and Silicon Intellectual Property (SIP) solution provider for the Embedded, Networking, and Consumer Electronics Market. GDA is part of the L&T Infotech Product Engineering Services (PES) offerings, which aims to provide end-to-end product design capability to its customers. GDA and Rambus work closely together to meet customers' accelerated time-to-market needs by utilizing Rambus' leading IP solutions and GDA's comprehensive design services. GDA is a reseller and integrator of Rambus digital core intellectual property (IP) products, which include a complete line of controller cores for PCI Express, Ethernet, SPI4.2 and RapidIO implementations. All core architectures are highly configurable and tailored to optimize link utilization and latency while minimizing power consumption and silicon footprint. The PCI Express cores support standard versions 1.1 and 2.0 and include end point, root complex, hybrid (root complex and end point), switch port, and entire switches. Bridge interfaces to standard on-chip buses such as AHB and AXI are also available.

For more information, please visit:

ファイバチャネル、イーサネット、RapidIOおよびSPI-4.2

ラムバスのファイバチャネル、イーサネット、RapidIO、およびSPI-4.2 SerDesセルは、お客様の通信システムの独特な設定や要件を満たす幅広いソリューションを提供します。お客様は、消費電力を抑え、高いポート密度を可能にしながら最適なフォームファクタを構築することができます。これらのセルは全てシリコン実証済みであり、厳格な評価と特性測定の実施によって標準コンプライアンスに適合またはそれを卓越することが保証されています。

ラムバスのファイバチャネル、イーサネット、RapidIO、およびSPI-4.2 SerDesセルに関する詳細情報は、ラムバス提携パートナーまでご連絡ください。


PCI ExpressおよびPCI-SIGは、PCI Express Special Interest Groupの登録商標です。PCI-SIGは、PCIの仕様をオープン業界スタンダードとして所有および管理する特殊事業団体です。