Articles et présentations

Tout au long de l’année, les experts de la technologie Rambus prennent la parole lors de conférences de l’industrie et de sommets techniques. Vous trouverez ci-après les articles et les présentations provenant de ces événements.

DVCon 2008

DVCon is the premier conference for functional design and verification of digital electronic systems. Rambus was proud to present the following papers at DVCon 2008.

Papers

DesignCon 2008

DesignCon is Silicon Valley's premier conference and technology exhibition for the semiconductor and electronic design engineering communities. Rambus was proud to be the Corporate Partner for DesignCon 2008 and present the following papers.

Papers

Rambus Design Seminar Bangalore 2008

Rambus Design Seminar Bangalore explored the future of high-performance memory designs:

  • Types of memory systems required for next generation consumer applications and how these advanced memory systems will solve tomorrow's system challenges
  • Innovative techniques developed by Rambus to improve memory performance and reduce overall system costs
  • Rambus' latest development initiative, the Terabyte Bandwidth Initiative, which enables 1 TB/s of memory bandwidth performance into a single SoC

Presentations

International Conference on VLSI Design and Embedded Systems 2008

This joint-conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, electronic design automation (EDA), enabling technologies, and embedded systems. It covers the entire spectrum of activities in the two vital areas of VLSI and embedded systems, which underpin the semiconductor industry. Rambus was proud to be a Gold sponsor and present the following.

Presentations

Rambus Developer Forum Japan 2007

Rambus Developer Forum (RDF) Japan is an annual Rambus-sponsored event that draws close to 1,000 visitors from the greater Tokyo region, including customers and partners from throughout Asia Pacific.

Presentations

Keynote:

Track 1: Rambus Leadership Technology

Track 2: XDR Applications

Track 3: Design Verification & Measurement

Track 4: Sytem Timing Budgeting and Power Integrity for High Speed I/O Systems

Track 5: Low Power Technology

Track 6: High Performance Sytem Enginnering: From Design to Mass Production

Track 7: DDR2/3 Memory Controller Interfaces

Track 8: Memory Controller Solutions

Rambus Design Seminar Europe 2007

The Rambus Design Seminar series in Europe explored the types of memory systems required for next-generation consumer applications and how advanced memory systems will solve today's and tomorrow's system challenges. To learn more, download presentations from this event.

Presentations

CDNLive! Silicon Valley 2007

CDNLive! is a global series of technical conferences where Cadence® technology users and other industry experts can network and exchange ideas. Rambus was proud to participate in CDNLive! Silicon Valley 2007 and present the following.

Presentations

Agilent Measurement Forum Taiwan 2007

Joseph Lin, Rambus Sales Director, presented the following at Agilent Measurement Forum Taiwan 2007.

Presentations

Denali MemCon San Jose 2007

MemCon is the largest worldwide conference and exhibition addressing the business, technology, and system design strategies for semiconductor memory and storage. Rambus was proud to be a Platinum sponsor of MemCon San Jose and present:

Presentations

Rambus Design Seminar Taipei 2007

Rambus Design Seminar Taipei explored memory solutions for advanced digital consumer electronics:

  • The benefits of XDR™ memory architecture for advanced digital consumer electronic systems including HDTV, HD projectors and game consoles
  • How an expanding supply base of leading DRAM manufacturers and IC suppliers make the high-performance XDR memory architecture ideally suited for these high-volume consumer electronics applications

Presentations

The Linley Group's High-speed Interconnects 2007 Seminar

The Linley Group offers live one-day technical seminars focused on specific system-design topics. Rambus was proud to participate in the High-speed Interconnects seminar and present the following:

Presentations

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