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合作伙伴解决方案
Rambus 与业界领先的技术公司联手为客户提供高速接口。可通过 Rambus 的合作伙伴获得 Rambus 用于 PCI Express®、光纤通道和其他网络接口的数字逻辑和物理接口。
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Cadence
Cadence enables global electronic-design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence® software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. Cadence reported 2006 revenues of approximately $1.5 billion, and has approximately 5,300 employees. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
For more information, please visit:
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ChipX
ChipX, Inc. is a Mixed-Signal ASIC company with the broadest offering of value-added ASIC solutions, including Standard Cell, Structured ASIC, Embedded Array and Hybrid ASIC technology. ChipX has unique expertise in PCI Express, USB 2.0, DDR/DDR2 and data conversion Mixed-Signal cores; all are silicon proven and certified and they can be integrated in customers' ASICs with a record first-time to market success. ChipX products are widely used in consumer equipment, computing peripherals, communication systems, instrumentation and industrial control, medical equipment and military/aerospace systems. Headquartered in Santa Clara, CA, ChipX is a privately held corporation, with a Research and Development subsidiary in Israel. Investors include Elron Electronic Industries, Ltd. (NASDQ: ELRN), VantagePoint Venture Partners, Wasserstein Venture Capital, UMC and Needham Capital Partners.
For more information, please visit:
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GDA Technologies and Rambus
GDA Technologies is a leading Electronic Design Services (EDS) and Silicon Intellectual Property (SIP) solution provider for the Embedded, Networking, and Consumer Electronics Market. GDA is part of the L&T Infotech Product Engineering Services (PES) offerings, which aims to provide end-to-end product design capability to its customers. GDA and Rambus work closely together to meet customers' accelerated time-to-market needs by utilizing Rambus' leading IP solutions and GDA's comprehensive design services. GDA is a reseller and integrator of Rambus digital core intellectual property (IP) products, which include a complete line of controller cores for PCI Express, Ethernet, SPI4.2 and RapidIO implementations. All core architectures are highly configurable and tailored to optimize link utilization and latency while minimizing power consumption and silicon footprint. The PCI Express cores support standard versions 1.1 and 2.0 and include end point, root complex, hybrid (root complex and end point), switch port, and entire switches. Bridge interfaces to standard on-chip buses such as AHB and AXI are also available.
For more information, please visit:
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PGC and Rambus
Progate Group Corporation (PGC), established in 1991, is a world-class IC design turnkey service company. It is part of TSMC Design Center Alliance (DCA) program for over ten years. PGC's rich design experiences can provide customers the benefits of first-silicon-right and fast-time-to-market.
The gate array ASIC and structured ASIC that PGC offers are good solutions for NRE cost-sensitive customers. These two solutions can provide not only low-NRE solutions but also fast turn-around time. They are suitable for most mid-to-small volume customers. In addition to the gate array and structured ASIC, PGC also provides excellent IP integration for SOC projects. PGC can provide the customers experienced IP integration and netlist-to-GDS II design turnkey service.
PGC and Rambus Inc. have collaborated to develop fully integrated and independently verified PCIe solution. By collaborating with Rambus, PGC provides the client a high-end PCI-Express switch chip, which integrates high performance PCI-Express switch and PCI bridge functionality. It has been qualified for compliance test of PCI-SIG.
For more information, please visit:
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PCI Express®
与 PCI 和 SIG 兼容以及经过互用性测试的 Rambus PCI Express 解决方案已经实施，并被众多大容量应用采用。Rambus 数字核心 IP 具备适用的应用接口，可最大程度地降低集成所需的胶连逻辑量。Rambus PHY 单元作为完整的串行通信单元而提供，专为最大程度提高产量而优化。
Rambus 的最新 PCI Express 产品 (Rambus Gen2 Total Solution) 提供 5Gbps 的高速点对点串行连接，并支持 3Gbps SATA 的模块化配置。除了 PHY 层，Gen2 解决方案由数字控制器和 MAC 层组成，同时还具备系统内诊断和测试功能。Rambus Gen2 Total Solution 结合后端集成、验证、封装和机板设计支持，实现了从概念到批量生产的快速部署。
Rambus PCI Express 1 解决方案提供 2.5Gbps 的 I/O 连接。经过生产验证的 Rambus 数字控制器和 PHY IP 可用于 180 纳米、130 纳米、90 纳米和 65 纳米四种处理空间，在 PCI-SIG 集成商清单上占有多个条目，目标是多家铸造厂和 ASIC ODM，仍是领先的 PCI Express 解决方案。
要了解有关 Rambus PCI Express 解决方案的更多信息，请与 Rambus 的以下任一合作伙伴联系：
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Cadence
Cadence enables global electronic-design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence® software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. Cadence reported 2006 revenues of approximately $1.5 billion, and has approximately 5,300 employees. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
For more information, please visit:
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eSilicon and Rambus
eSilicon, a pioneering semiconductor Value Chain Producer (VCP), provides a comprehensive suite of design, productization and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume production of integrated circuits (ICs). The company delivers chips to system original equipment manufacturers (OEMs) and fabless semiconductor companies who serve a wide variety of markets including the consumer, computer, communications and industrial segments.
eSilicon creates a unique, optimized semiconductor Value Chain for each customer and each design - from design services and tools, to IP and materials suppliers, to test and packaging providers. By integrating this Value Chain with its internal expertise and proven eSilicon Enterprise™ infrastructure, the company has produced more than 30 million leading-edge chips for a wide range of applications including consumer, computer, communications and industrial solutions.
As a semiconductor Value Chain Producer, eSilicon has a long track record of succcessful engagements with our customers to implement chips involving both complex and simple IP blocks. The value that eSilicon brings to its customers is successful integration of complex IP (e.g. SerDes) with a multitude of other IP on the same chip and quickly productizing the chips into volume production, thus enabling our customers' silicon success.
eSilicon has utilized SerDes IP from Rambus, one of its Value Chain partners to successfully design, manufacture and productize chips for many different customers. These customers represent the communications, networking and storage market segments and the engagements involved both netlist handoff and gdsii handoff engagements.
To learn more about eSilicon and what it can offer, please visit http://www.esilicon.com/about_us/about_us.php or send an e-mail to info@esilicon.com.
For more information, please visit:
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GDA Technologies and Rambus
GDA Technologies is a leading Electronic Design Services (EDS) and Silicon Intellectual Property (SIP) solution provider for the Embedded, Networking, and Consumer Electronics Market. GDA is part of the L&T Infotech Product Engineering Services (PES) offerings, which aims to provide end-to-end product design capability to its customers. GDA and Rambus work closely together to meet customers' accelerated time-to-market needs by utilizing Rambus' leading IP solutions and GDA's comprehensive design services. GDA is a reseller and integrator of Rambus digital core intellectual property (IP) products, which include a complete line of controller cores for PCI Express, Ethernet, SPI4.2 and RapidIO implementations. All core architectures are highly configurable and tailored to optimize link utilization and latency while minimizing power consumption and silicon footprint. The PCI Express cores support standard versions 1.1 and 2.0 and include end point, root complex, hybrid (root complex and end point), switch port, and entire switches. Bridge interfaces to standard on-chip buses such as AHB and AXI are also available.
For more information, please visit:
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Fibre Channel、Ethernet、RapidIO 和 SPI-4.2
Rambus 的 Fibre Channel、Ethernet、RapidIO 和 SPI-4.2 SerDes 单元提供各种解决方案，以满足您的通信系统独特的配置和需求。在最小的能耗和较高端口密集度条件下，让您建立优化的外形因素。这些单元均经过硅验证和严格的评估和定性，以确保其符合或高于标准。
要了解有关 Rambus 的 Fibre Channel、Ethernet、RapidIO 和 SPI-4.2 SerDes 单元的更多信息，请与 Rambus 的以下任一合作伙伴联系：
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PCI Express and PCI-SIG are registered trademarks of the PCI Express Special Interest Group. The PCI-SIG is the special interest group that owns and manages PCI specifications as open industry standards.
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