Press Release

Rambus Signs Memorandum of Understanding with Spansion

Companies Collaborate On Next-Generation Flash Memory Solutions

Los Altos, California, United States  - 04/23/2008   Rambus Inc. (Nasdaq: RMBS), one of the world's premier technology licensing companies specializing in high-speed memory architectures, today announced that it has signed an agreement for DDR engineering services and a memorandum of understanding for future development of MirrorBit® Flash memory solutions with Spansion® Inc. (Nasdaq: SPSN), the world's largest pure-play provider of Flash memory solutions.

Initially, Rambus will provide Spansion with DDR engineering services in support of accelerating time-to-market for robust, high-volume Spansion products. Services include signal integrity simulations, system and package design, and precision in-system voltage and timing margining.

"Flash memory content in electronic devices continues to grow, enabling increasingly innovative and differentiated consumer electronics products," said Ali Pourkeramati, executive vice president, Applications and Platform Engineering, at Spansion. "Our deep Flash memory expertise coupled with Rambus' signal integrity and memory interface experience will provide an enhanced opportunity to create the next generation of advanced MirrorBit Flash memory solutions."

"With its preeminent expertise in Flash memory, Spansion is ideally positioned to deliver the breakthrough solutions needed by future consumer electronics products," said Martin Scott, senior vice president of Engineering at Rambus Inc. "Together, we look forward to making significant advancements in the capabilities of Flash memory systems."

Rambus and Spansion signed a patent license agreement in early 2007. With a primary focus on the integrated Flash memory market, Spansion solutions are incorporated into electronic products from Original Equipment Manufacturers (OEMs), including the world's top ten handset, consumer electronics and automotive OEMs around the world.

Safe Harbor Statement

This release contains forward-looking statements under the Private Securities Litigation Reform Act of 1995. Such forward-looking statements are based on current expectations, estimates and projections about the Company's industry, management's beliefs, and certain assumptions made by the Company's management. Actual results may differ materially. Our business generally is subject to a number of risks which are described more fully in our SEC filings including our 10-K and 10-Qs.

关于Rambus Inc.

Rambus 是全球首屈一指的专长于高速芯片接口发明与设计的技术授权企业。公司始建于1990 年,其专利的创新技术、突破性技术以及著名的集成专家经验帮助业内领先的芯片与系统企业向市场上推出卓越产品。Rambus 的技术与产品能够解决客户最复杂的芯片与系统级接口难题,从而帮助计算、通信与消费电子设备实现前所未有的性能。Rambus 为其世界级的专利组合以及领先的行业标准接口系列产品发放使用授权。Rambus 总部位于加利福尼亚州Los Altos,在北卡罗来纳州、印度、德国、日本和台湾等地设有地区性办事处。了解更多信息,请访问网站 www.rambus.com.cn 。



Rambus and the Rambus logo are registered trademarks of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.

Spansion®, the Spansion Logo®, MirrorBit®, ORNAND™, ORNAND2™, HD-SIM™ and combinations thereof, are trademarks of Spansion LLC. Spansion, the Spansion Logo and MirrorBit are registered in the US and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.

 

Contacts

Linda Ashmore
Rambus 公司公共关系部
(650) 947-5411
lashmore@rambus.com

Lisa Kennedy
Citigate Cunningham for Rambus
(415) 618-8726
lkennedy@citigatecunningham.com

Courtney Brigham
Spansion Public Relations
(408) 616-5056