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Historical Milestones
2009
| Month |
Description |
| June 2009 |
XDR™ DRAM surpasses 100 million units shipped |
| May 2009 |
Rambus unveils a set of innovations that can advance computing main memory beyond current DDR3 data rate limits |
| April 2009 |
Rambus aquires patents from Inapac to broaden its offerings for the mobile memory market |
| February 2009 |
Rambus announces Mobile Memory Initiative to achieve a high-bandwidth, low-power memory interface solution for next-generation mobile devices |
2008
| Month |
Description |
| July 2008 |
Rambus and Qimonda sign amended patent license agreement |
| March 2008 |
Industry ships 50 million XDR™ DRAM memory devices |
| February 2008 |
Rambus XDR™ Memory Architecture named 2008 DesignVision winner |
2007
| Month |
Description |
| December 2007 |
Toshiba licenses Rambus XDR™ Memory Architecture for HDTV chipset |
| November 2007 |
Rambus launches Terabyte Bandwidth Initiative |
| June 2007 |
Rambus XDR™ memory architecture adopted in Texas Instruments DLP projector |
| June 2007 |
Industry ships 25 million XDR™ DRAM memory devices |
| January 2007 |
Rambus and Spansion sign patent license agreement |
| January 2007 |
Qimonda and Rambus sign technology license for XDR™ DRAM |
2006
| Month |
Description |
| November 2006 |
Rambus technology is adopted in the PlayStation®3 computer entertainment system |
| October 2006 |
Toshiba licenses Rambus XDR™ memory and PCI Express® interface solutions |
| September 2006 |
Rambus launches Gen2 Total Solution designed for PCI Express® |
| June 2006 |
Rambus reaches 500th issued patent milestone |
| March 2006 |
Rambus signs patent license agreement with Fujitsu, covering semiconductors and systems |
| January 2006 |
Rambus signs patent license agreement with AMD |
2005
| Month |
Description |
| September 2005 |
Rambus signs patent license agreement with Renesas Technology Corp. |
| July 2005 |
Rambus introduces next-generation XDR™2 DRAM offering unprecedented graphics performance
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| June 2005 |
Rambus signs new technology license agreement with IBM |
| May 2005 |
Rambus reaches 400th issued patent milestone |
| May 2005 |
Rambus XDR™ and FlexIO™ revealed as key interface technologies in Sony Computer Entertainment's PlayStation®3 |
| May 2005 |
Dr. Mark Horowitz named as Rambus Chief Scientist |
| April 2005 |
Rambus acquires digital core IP from GDA Technologies |
| April 2005 |
Rambus unveils micro-threading technology for DRAM cores |
| March 2005 |
Industry ships 500 millionth RDRAM® memory device |
| March 2005 |
Rambus opens design center in Bangalore, India |
| February 2005 |
Cell Processor from Sony, Toshiba, and IBM uses Rambus high speed interface solutions |
| January 2005 |
Rambus announces Harold Hughes as new CEO; Geoff Tate becomes Chairman of the Board |
2004
| Month |
Description |
| October 2004 |
Toshiba announces its selection of Rambus DDR2 interface technology |
| September 2004 |
Rambus demonstrates its dynamic point-to-point topology |
| July 2004 |
Rambus signs agreements with Cadence to deliver portfolio of high-speed serial link solutions |
| March 2004 |
Toshiba and Rambus announce serial link cell agreement |
| February 2004 |
Rambus showcases industry's first TSMC 90 nanometer serial link cell solution |
2003
| Month |
Description |
| December 2003 |
Rambus acquires serial interface assets of Velio |
| November 2003 |
SiS launches R659 four channel RDRAM® chipset |
| July 2003 |
Rambus launches XDR™ DRAM, world's fastest memory |
| June 2003 |
Rambus samples industry's first chips with RaSer™ PCI Express® PHY cell |
| February 2003 |
SiS, Samsung, ASUS and Rambus announce joint development of 4-channel RDRAM® performance chipset |
| February 2003 |
Rambus unveils Redwood, the industry's fastest parallel bus logic interface |
| January 2003 |
Rambus RDRAM® memory interface ships in award-winning HP AlphaServer systems |
| January 2003 |
Rambus signs technology license agreements with Sony, Sony Computer Entertainment and Toshiba |
2002
| Month |
Description |
| October 2002 |
Toshiba selects Rambus Yellowstone interface solution for next generation memory devices |
| October 2002 |
Rambus announces industry's first 10 Gbps backplane serial link solution, RaSer™ X |
| October 2002 |
Intel announces availability of 850E chipset supporting dual-channel 1066 RDRAM® memory for Pentium 4-based PCs |
| September 2002 |
Rambus announces Samsung Electronics has incorporated RDRAM® technology into next-generation rear-projection HDTV |
| July 2002 |
Rambus announces Texas Instruments Digital Light Processing display controllers with RDRAM® memory |
| July 2002 |
Rambus licenses RaSer™ serial link technology to Intel for Ethernet applications |
| July 2002 |
Rambus unveils first public demo of Yellowstone with FlexPhase™ technology, operating at 3.2GHz, at RDF Japan |
| June 2002 |
Rambus announces availability of RIMM™ 4200 memory module design using 1066 MHz RDRAM® memory, providing 4.2GB/s of memory bandwidth |
| June 2002 |
Juniper Networks uses Rambus RDRAM® technology for new T-Series family of Internet routers |
| June 2002 |
Rambus announces the first 6.4 Gbps backplane serial link cell, RaSer™ V |
2001
| Month |
Description |
| October 2001 |
Rambus announces licensing of RaSer™ serial link cell to Intel Microelectronics Services |
| September 2001 |
Rambus announces next generation high-speed signaling technology "Yellowstone", operating at Octal Date Rates, transferring 8 bits per clock |
| May 2001 |
Texas Instruments introduces first validated 533MHz Rambus RDRAM® clock generator |
2000
| Month |
Description |
| October 2000 |
Sony begins shipping highly anticipated game console, the PlayStation®2, with RDRAM® |
| October 2000 |
Rambus expands to Taipei, Taiwan |
| July 2000 |
Rambus announces first DRAM to break 1 GHz speed barrier |
| June 2000 |
Samsung ships 10 millionth RDRAM® to PC OEMs |
| June 2000 |
Rambus announces multi-level signaling technology capable of data transfer rate of 1.6 Gbps |
| April 2000 |
Rambus announces 3.125 GB/sec RaSer™ serial link |
1999
| Month |
Description |
| November 1999 |
Rambus-based PCs and workstations begin shipping from multiple suppliers |
1998
| Month |
Description |
| November 1998 |
Intel demonstrates working systems with 800MHz Rambus DRAMs at Fall COMDEX '98 |
| June 1998 |
Toshiba and LG Semicon ship functional RDRAM® devices |
1997
| Month |
Description |
| May 1997 |
Rambus makes initial public offering of common stock |
1996
| Month |
Description |
| December 1996 |
Rambus and Intel disclose agreement to evolve chipsets and DRAMs that incorporate Rambus interfaces to meet requirements of PC main memory |
1995
| Month |
Description |
| December 1995 |
Nintendo64 ships with RDRAM® memory interface |
1992
| Month |
Description |
| February 1992 |
Rambus Japan (RKK) is incorporated |
1990
| Month |
Description |
| March 1990 |
Rambus is incorporated |
PCI Express and PCI-SIG are registered trademarks of the PCI Express Special Interest Group. The PCI-SIG is the special interest group that owns and manages PCI specifications as open industry standards.
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